3rd International Conference on Signal Processing, VLSI Design & Communication Systems (SVC 2022) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of on Signal Processing, VLSI Design & Communication Systems. The aim of the conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.
Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the areas of Signal, VLSI & Communication systems.
Signal Processing
VLSI Design
Communication Systems
Authors are invited to submit papers through the conference Submission System by CLOSED.
Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).
SubmitSelected papers from SVC 2022, after further revisions, will be published in the special issues of the following journals
Third Batch : (Submissions after November 13, 2021)
Submission Deadline : CLOSED
Authors Notification : January 10, 2022
Registration & Camera-Ready Paper Due : January 15, 2022
Second Batch : (Submissions after September 25, 2021)
Submission Deadline : November 13, 2021
Authors Notification : November 30, 2021
Registration & Camera-Ready Paper Due : December 08, 2021
Frieda Josi
University of Applied Sciences and Arts Hanover,
Germany
Wei Liu
Chongqing University of Posts and Telecommunications,
China
Cheng Huang
Chongqing University of Posts and Telecommunications,
China
Bo Li
Chongqing University of Posts and Telecommunications,
China
Zhen Zhang
Guangxi Normal University,
China
Nur Nasuha Binti Mohd Daud
University of Malaya, Malaysia
Tayeb Basta
Al Ghurair University, United Arab Emirates
Leo Liao
USA
Xinrui Que
USA
Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC Digital Library
Copyright © SVC 2022